Use high-purity gold and copper wires to connect pad and lead frame quality control (gold wire neck and tail tension, gold ball thrust, gold wire arc height, gold ball thickness, crater test, intermetallic compound test).Īfter the lead welding is complete, perform microscope sampling to observe the welding quality. Put silver paste on the pad of the lead frame.ġ75℃, 1 hour N2 environment, prevent oxidation. Paste the wafer on the mylar so that it will not fall apart even after being cut cut the entire wafer into individual dices through the saw blade, which is convenient for the subsequent die attach process clean the wafer and clean the dust produced. After grinding, remove the tape and measure the thickness. When grinding the wafer, it is necessary to stick tape on the front to protect the circuit area and grind the back at the same time. The wafer from the fab will be back-grinded to reduce the wafer’s thickness to the package thickness (8mils~10mils). Incoming quality inspection of wafers, lead frames, silver paste, bonding wires, molding materials, etc. The properties, performance, and limitations of these components check the temperature, voltage, frequency, and other parameter characteristics of these components or equipment. The purpose is to analyze data on mobile phone components and to understand this component and process.
It is used to generate specifications and datasheets for products, processes, or packaging. AEC-Q003 is a characteristic guideline proposed for the typical performance of chip tea farmers. It is widely used to make early detection in the wafer and bare die stages. It provides component manufacturers with statistical techniques to detect and remove abnormal chip components. AEC-Q002 is based on statistical principles, and it is a statistical yield analysis. AEC-Q001 mainly proposes the Parametric Part Average Testing (PPAT) method, a statistical method used to detect abnormal characteristics of outer semiconductor components and remove abnormal components from all products. The reputation of this event has spread coast to coast.AEC-Q001/Q002/Q003 standards are mainly guiding principles. The technical classes will include outstanding presentations of the hottest topics including emerging technologies. The exhibit hall will be filled with a diverse list of vendors offering a range of products and services. We are committed to producing the best trade show possible. PCB Carolina is organized and run by the volunteers of PEPAC. This is the place to be If you are involved in any stage of electronics: Product Development, PCB Design, Signal Integrity, Electrical Engineering, Firmware, Thermal, Mechanical, Test, Inspection, Contract Manufacturing, Technician, Debug, Compliance, Analysis, Purchasing, Management, etc.
#Pcb electronics free
There will be 16 technical sessions, a keynote address, a vendor exhibition with over 70 companies participating, food throughout the day, and best of all, this event is FREE to all attendees. Located in Raleigh near Research Triangle Park makes this a prime area for this highly technical conference on electronics. PCB Carolina (TM) is North Carolina's Premier Electronics Trade Show.
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